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Electroplated Diamond Dicing Hub Blade

Basic Info

Model No.: ATN-DC-AB

Material: Diamond

Abrasive: Superabrasive

Shapes: Section Shape

Types: Cutting Wheel

Grain Size: 280#

Cylindricity: <0.02

Circular Degree: <0.01

Technics: Sinter

Working Style: Cutting

Blade Thickness: 15-50mm

Concentration: AC,BC.CC,EC,FC

Exposure: 390-1020,or Special

Kerf: 16-40 Or Special

Grit Size: 1-50um

HARDNESS: Soft,Middle ,Hard

Application: PCB,BGA,Ceramic Substrate Material

Product Description

Product Features

1. Hign toughness;

2. High precision;

3. Superthin;

4. Long life span;

5. Easy to use;

6. High performance;

7. Wide range of application;

8. Various specifications and sizes;

9. Short supply cycle.

Product Description

The Electroplated Diamond blades with hub are mainly used for grooving, cutting and dicing silicon wafers, GaAs, glasses, ceramics, quartz, compound Semiconductor Materials, etc. This product has high precision and long life span. And their performance has achieved the level of similar products at abroad



The Hub Nickel Dicing Blade 2


Contact us if you need more details on Nickel Diamond Hub Blades for PCB. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Lectroplated Diamond Dicing Hub Blade、Nickel Diamond Hub Blades for Silicon Wafer. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Blade Series > Sail Nickel Diamond Hob Blade

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