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Eletroplated Bond Dicing Blades

Basic Info

Model No.: ATN-DC-AB

Product Description

Choosing dicing blades with five important parameters

1.Diamond grit

2.The length of blade edge

3.The thickness of blade edge

4.The styles of adhesive

5.The styles of diamond concentration

Application scope:

Silicon wafer,GaAs,GaP,sapphire,ceramic



The Hub Nickel Dicing Blade 2

Packaging & Delivery


Packaging Details:Plastic box.

Diamond Dicing Blades

By employing new technologies and imported facilities, Sail company produce series electroplated bond blade with Hub is our company`s high level product. A combination of an ultra-thin Diamond Blade and a aluminum hub provides enhanced operation efficiency and stable cutting result. By adjusting blade strengthens rigidity and prevents slant or wavy cutting, avoid blade`s broken.

Features:

High strength, high accuracy, ultra-thin, long life and easy to operation

Bevel and step cutting

Shorter blade change time-increased productivity.

Wide range of grit sizes and bond types to support various application requirements

Applications: Silicon, Gallium arsenide, Gallium phosphide, Gallium arsenide phosphide, etc.




Contact us if you need more details on Eletroplated Bond Dicing Blades. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Diamond Blades for Silicon、Nickel Diamond Hub Blades for Ceramic Substrate Material. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Blade Series > Sail Nickel Diamond Hob Blade

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