Shapes: Section Shape
Types: Cutting Wheel
Grain Size: 280#
Circular Degree: <0.01
Working Style: Cutting
We are offering diamond dicing blades.
1.high strength ,high accuracy ,ultra-thin ,long life and easy to operation
2.bevel and step cutting
3.shorter blade change time –increased productivity .
4.wide range of grit sizes and bond types to support various application requirements.
standard of classfication
1. shape of hub
2. particle size of diamond powder
3. concentration of diamond powder
4. hardness of nickel alloy
1.basic part: alufer
2.cutting edge part: mixture with nicked alloy and diamond
choosing dicing blade with five important parameters:
2.the length of blade edge
3.the thickness of blade edge
4.the styles of adhesive
5.the style of diamond concentration
above 5 elements is the main considerations for choosing hard blades. The specific details also rely on the usage, request and working conditions.
1.semiconductor discrete devices: gpp, mosfet, sky, diode
2.integrated circuit: bga, qfn, pcb, epoxy, alloy framework plastic board, composite plate with sandwich, ceramic substrate led.
3.semiconductor chemical compund: gallium arsenide(gaas) ,gallium phosphide(gap),gallium arsenide phosphide,etc.
4.silicon (si) wafer die
5.others: ltcchtcc, image sensor
- series : hard blade