Company Details

  • Suzhou Sail Science & Technology Co., Ltd.

  •  [Jiangsu,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Worldwide
  • Exporter:51% - 60%
  • Certs:ISO9001
  • Description:Diamond Dicing Blades,NICKEL Bond Dicing Blades,Electroformed Hub Diamond Blades
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Suzhou Sail Science & Technology Co., Ltd.

Diamond Dicing Blades,NICKEL Bond Dicing Blades,Electroformed Hub Diamond Blades

Diamond Dicing Blades

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    Unit Price: USD 100 - 30 / Bag/Bags
    Payment Type: T/T
    Incoterm: FOB,CIP
    Min. Order: 30 Bag/Bags
    Delivery Time: 10 Days

Basic Info

Material: Diamond

Abrasive: Superabrasive

Shapes: Section Shape

Types: Cutting Wheel

Grain Size: 280#

Cylindricity: <0.02

Circular Degree: <0.01

Technics: Sinter

Working Style: Cutting

Type: 1M8

Additional Info

Packaging: bags and carton

Productivity: 1200PCS PER MONTH


Transportation: Air


Supply Ability: 300PCS PER WEEK

Certificate: ISO9001:2015

HS Code: 8202391000

Port: Shanghai Airport

Product Description

We are offering diamond dicing blades.
1.high strength ,high accuracy ,ultra-thin ,long life and easy to operation
2.bevel and step cutting
3.shorter blade change time –increased productivity .
4.wide range of grit sizes and bond types to support various application requirements.
standard of classfication
1. shape of hub
2. particle size of diamond powder
3. concentration of diamond powder
4. hardness of nickel alloy

product ingredient
1.basic part: alufer
2.cutting edge part: mixture with nicked alloy and diamond

choosing dicing blade with five important parameters:
1.diamond grit
2.the length of blade edge
3.the thickness of blade edge
4.the styles of adhesive
5.the style of diamond concentration

above 5 elements is the main considerations for choosing hard blades. The specific details also rely on the usage, request and working conditions.

1.semiconductor discrete devices: gpp, mosfet, sky, diode
2.integrated circuit: bga, qfn, pcb, epoxy, alloy framework plastic board, composite plate with sandwich, ceramic substrate led.
3.semiconductor chemical compund: gallium arsenide(gaas) ,gallium phosphide(gap),gallium arsenide phosphide,etc.
4.silicon (si) wafer die
5.others: ltcchtcc, image sensor

  • series : hard blade

The Hub Nickel Dicing Blade 2

Looking for ideal Diamond Dicing Blades Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the NICKEL Bond Dicing Blades are quality guaranteed. We are China Origin Factory of Electroformed Hub Diamond Blades. If you have any question, please feel free to contact us.

Product Categories : Sail Blade Series > Sail Nickel Diamond Hob Blade

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  • Diamond Dicing Blades
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