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  • Suzhou Sail Science & Technology Co., Ltd.

  •  [Jiangsu,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Worldwide
  • Exporter:51% - 60%
  • Certs:ISO9001
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Suzhou Sail Science & Technology Co., Ltd.

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(Total 24 Products for The Low Chipping)

The Low Chipping

We are specialized The Low Chipping manufacturers & suppliers/factory from China. Wholesale The Low Chipping with high quality as low price/cheap, one of the The Low Chipping leading brands from China, Suzhou Sail Science & Technology Co., Ltd..
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A hub nickel Dicing blade for Silicon
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

China Manufacturer of The Low Chipping

Tag: Silicon Wafer Dicing Blades , The Gallium Arsenide Material , The Low Chipping

ALHN series hub nickel Dicing blade use the special surface treatment technology in plating substrates, the substrates can reach mirror surface,mechanical precision < 2μm. The blade have the few deflection and high cutting quality application....

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The High Quality Hub Nickel Dicing Blade
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

High Quality The Low Chipping China Supplier

Tag: Prevent the Back Chipping , High Stable Cutting , High Quality Hub Nickel Dicing Blade

The back chipping is a problem in the hub nickel Dicing blade, the series blade solve the problem thought reducing the strength of bond and the content of diamond. Features: 1. This series blade designed for hard brittle material to solve the back...

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The Multifunction Hubless Nickel Dicing blade
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Professional Manufacturer of The Low Chipping

Tag: A Variety of Material Cutting , The Ultra-Thin Cutting , The Blade for Slotting

These blades employ electroformed bonds that realize superb cutting quality and blade life.In addition to dicing semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages. Features: 1. Deep cutting and...

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The grinding wheels for LED substrate
  • Brand: Sail-tech
  • Packaging: Bags or Cartons
  • Supply Ability: 500 Pieces Per week
  • Min. Order: 30 Bag/Bags
  • Certificate: ISO9001:2008

Expert Manufacturer of The Low Chipping

Tag: The Grinding Wheels , Wheels for LED Substrate , The Grinding Wheels for LED Substrate

The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer....

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The Hubless Nickel Dicing Blade for Ceramic
  • Packaging: BAGS OR CARTOONS
  • Model No.: BTNBC
  • Transportation: Ocean,Air
  • Material: Diamond
  • Abrasive: Superabrasive

China Supplier of The Low Chipping

Tag: Diamond Dicing Tools , Ultra-thin Saw Blade , Ceramic Dicing Blades

BCDS series hubless nickel Dicing blade realize the high cuttting of ceramics materials by reducing the diamond concentration and the bond strength. We are delicated to customer needs to offer two kinds of blades in the high life and the high...

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The Hub Nickel Dicing Blade for Ceramic
  • Packaging: bags or package
  • Model No.: ATN-BC-AA
  • Transportation: Ocean,Air
  • Material: Diamond
  • Abrasive: Superabrasive

China Factory of The Low Chipping

Tag: The Ceramic Dicing Blades , Make the Continuous Cutting , The Hub Nickel Dicing Blade for Ceramic

This series blade have the strong cutting ability by adding grinding of force of abrasive. The blade have a high quality and a high life cutting in Ceramic. Features: 1.designed for Ceramic cutting. 2.Make the Continuous Cutting by self-lubricating...

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The Back Grinding Wheels for GaN Wafer
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: With Handle
  • Types: Surface Grinding Wheel
  • Cylindricity: <0.05

The Low Chipping Export

Tag: The Precision Back Grinding Wheels , Superior Grinding Performance , The High Shape Preserving

Specifications 1.be used with Japanese, German, American, Korea and Chinese grinders 2.superior grinding performance 3.high cost performance Shape code Profile Sketch Conventional Specification

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The Hubless Nickel Dicing Blade for Packaging Materials
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Competitive The Low Chipping China Supplier

Tag: The Packaging Materials Cutting , The Low Wear Blade , The Shape Keeping Blade

The Hubless Blade is a breakthrough from traditional package singulation solution,enabling step function improvement on cut quality, precision & productivity with significantly longer blade life, enabling ZERO Conversion of your singulation...

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The Hubless Nickel Dicing Blade for LED
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Leading Manufacturer of The Low Chipping

Tag: The Light Emitting Diode Cutting , The Hubless Blade , The Cutting for Slotting

Hubless Blades enables step function improvement on package singulation quality, precision and productivity by providing significantly longer life blade, improved stability. It is designed to fit and achieve your process and project requirement....

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The High Precision and Superthin Hubless Blade
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Professional Factory of The Low Chipping

Tag: The Diamond Tools , The Hubless Nickel Blade , The High Precision and Superthin

The high precision superabrasive cutting wheels are mainly used for precise cutting and slotting kinds of electronic component and precise part in the electronic information and the mechanical fields. features: 1.High precision, for grooving and...

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The High Life Hubless Nickel Dicing Blade
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Tag: The High Binding Force Blade , Different Specifications in Diamond Concentration , Both Life and Quality

The series developed for dicing various substrates adopts a larger grit size compared to the hub blades for semiconductor wafers. Also, the abundant concentration lineup responds to various customer requests. 1. Increases the choices for a blade...

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The Hubless Nickel Dicing Blade for Substrates
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Tag: The Cutting of Substrates Blade , Reduction in Resin/Metal Burring , The Abrasive Grain Size

The series developed for dicing various substrates adopts a larger grit size compared to the hub blades for semiconductor wafers. Also, the abundant concentration lineup responds to various customer requests. Features: 1. High processing quality...

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The Ultra-Thin Hubless Nickel Dicing Blade
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Tag: LED Board Dicing Blades , Ultra-Thin Saw Blades , Semiconductor Packaging Dicing Blades

BLFH series hubless nickel Dicing blade realize the ultra-thin cutting. The ultra-thin blade is produced by alkali corrosion of aluminum alloy to reduce the deformation. With high strength bond, the blade improve processing stability and reduce...

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The Hubless Nickel Dicing Blade for PCB
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Tag: The Printed Circuit Board Cutting , The Hubless Blade for PCB , The Myriametre Cutting Blade

THis series blade is designed for the Printed Circuit Board material. Provide different diamond concentration for client to chooes, In processing hard and brittle materials, process quality is improved while blade life is maintained. Features: 1. 5...

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The Hubless Nickel Dicing Blade by Porous Structue
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Tag: Porous Structue Electroplating , Composite Material Cutting , The Efficient Cutting

The series combines high cutting ability that is specific to electroformed bond blades and appropriate self sharpening ability by forming pores in the electroformed bond. It is now possible to process silicon + glass, silicon carbide (SiC) and...

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The Ultra-thin Bub Nickel Dicing Blade
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Tag: The Ultra-thin Blade , The High Speed Cutting , Silicon Wafer Cutting

This series blade realize the cutting less than 20μm in order to satisfy the Ultra-thin cutting of high-end clients. The blade solve wavy cutting though high strength bond and low temperature treatment. Features: 1. The hub nickel Dicing blade can...

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The Hub Nickel Dicing Blade by Slotting
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Tag: The Blade in Slotting , The Cooling Cutting , The High-speed Cutting

The series blade is designed for cooling in cutting PCB BGA and Ceramic material. By slotting the blade reduce the cutting temperatue, as the same time increase the cutting speed. Features: 1.Different number and specifications of slotting for...

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The High Precision Hubless Nickel Dicing blade
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Tag: The Low Top Side Broken , The Grinding Hub Blade , The Low Back Side Broken

The series Blade adopt grind process to control the mechanical precision, up to 2μm. By the grind process the surface of blade is smoothed effectively, so the quality of cutting get promotion. Features: 1.According to customer demand to provide...

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The Hub Nickel Dicing Blade for Copper
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Tag: The Copper Cutting Blade , Preventing The Passivation Technology , Prevent The Chipping Blade

Hub Blades for Copper Wafer Dicing Specially-formulated to resist loading when cutting copper-metallized wafers, the new CU Series hub blades reduce top and back side

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The Hub Nickel Dicing Blade for QFN
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Tag: Quad Flat No-leadPackage Cutting , The Slotting Blade for QFN , The Packaging Materials Cutting

QFN materials usually use the blalde with metal bond and resin bond, The quality of cutting in the Nickel blade can not meet the need of client. We solve this proble through optimizing the process and formula and adding the slotting. The hub nickel...

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The hub nickel Dicing blade for Silicon
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Tag: The Silicon Wafer Dicing Blades , The High Accuracy Dicing Tools , Low Back Side Chipping

The hub nickel Dicing blade of ALHN series design for Silicon cutting. the blade use the special surface treatment technology in plating substrates, the substrates can reach mirror surface, mechanical precision < 2μm. The blade have the few...

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The hub nickel Dicing blade for PCB
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Tag: Low Top Side Chipping , Diamond Dicing Tools for PCB , The Printed Circuit Board Dicing Blades

Under the premise of ensuring The cutting quality, By improving the strength bond and content of diamond , the ASTN series hub nickel Dicing blade realize the long life for cutting the Printed Circuit Board Dicing material. The diamond blade with...

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The Angle Hub Nickel Dicing Blade
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Cutting Wheel
  • Cylindricity: <0.02

Tag: The Angle Blade , The Slotting Blade , The Precision Cutting

With the slotting in different material, We manufacture the the Hub Nickel Dicing Blade in different angle to meet customer requirements. Features: 1. According to customer demand to provide different shape and angle blade. 2. This series offers...

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The Circular Arc Gear Finishing Grinding Wheel
  • Material: Diamond
  • Abrasive: Superabrasive
  • Shapes: Edge Shape
  • Types: Surface Grinding Wheel
  • Grain Size: 180#

Tag: High Precision Grinding Wheel Size , No Dressing Grinding Wheel , Workpiece Size Precision is High

Engine gear arc dressing wheel of high dimensional accuracy, cutting face sharp, high grinding efficiency. No dressing required. Dimensional shape to maintain good. Mainly used in the engine high-precision transmission gear grinding. Plating wheel...

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