Metal Bond Diamond for Cutting Ceremic
Product Description
Metal Bond Diamond Dicing Blades for cutting ceremic
Metal Bond Cutting Blade with electroplated Sintered metal powder is uesd as the bonding agent material to realize strong holding power.As a result,these blades have low blade wear.They are excellent for accurate cutting or grooving of elctronic devices such as csp packages,ceramics and optical material.
Product Categories : Sail Sintered Wheels And Sintered Drills > Sintered Grinding Wheels
Premium Related Products
Other Products
Hot Products
Single sand surface trimming grinding headCNC Single Sand Trimming Grinding HeadDual Punch Appearance DrillDual Grit Hole Shape GrindingElectroplated Grinding Wheel for Grinding GlassSingle Grit Camber Drillsingle grit core drillElectroplated Grinding Wheel for Magnetic MaterialsSilicon grinding wheelsSharp Resin Bond BladeUltra-thin resin bond bladeThe High Precision and Superthin Hubless BladeMetal Sintered Dicing BladesA hub nickel Dicing blade for SiliconResin bond grinding wheel40μm Ultra Thin Dicing Blade