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Back Grinding Wheels for Silicon Wafer

Basic Info

Model No.: SD2000N125

Type: Die Grinder, M

Power Source: Electricity

Object: Turning Tool

Application: Construction, Rough Grinding

Disc(Wheel) Type: Grinding Disc

Material: Metal

Working Style: High-speed universal

Disc Diameter: 230mm

Variable Speed: With Variable Speed

Bond: Metal

Material Of Workpieces: Silicon Wafer

Fetures: Long Life And High Efficiency

Outer Diameter: 200-304mm

Wide Of Layer: 2-7mm

High Of Layer: 5-10

Grit: 270-8000

Product Description

Back Grinding Wheels for Silicon Wafer

Back Grinding Wheels have Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.

Product characteristics

1. new bond will be developed according to processing materials ;

2. customer can customize blades of different specifications and work performance

3. New hot pressing molding technology ensures product quality stability


Processing objects

QFN.Optical Glass.ceramic materials ect.

Contact us if you need more details on Resin-Bond Grinding Wheels for Silicon Wafer. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Best Quality Latest Back Grinding Diamond Wheels for Silicon Waf、Grinding Wheels for Silicon Wafer. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Grinding Wheel Series > Sail Resin-bond Grinding Wheels

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