Model No.: SD2000N125
Back Grinding Wheels for Silicon Wafer
Back Grinding Wheels have Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.
1. new bond will be developed according to processing materials ;
2. customer can customize blades of different specifications and work performance
3. New hot pressing molding technology ensures product quality stability
QFN.Optical Glass.ceramic materials ect.