Suzhou Sail Science & Technology Co., Ltd.
Model No.: SD2000N125
Type: Die Grinder, M
Power Source: Electricity
Object: Turning Tool
Application: Construction, Rough Grinding
Disc(Wheel) Type: Grinding Disc
Working Style: High-speed universal
Disc Diameter: 230mm
Variable Speed: With Variable Speed
Material Of Workpieces: Silicon Wafer
Fetures: Long Life And High Efficiency
Outer Diameter: 200-304mm
Wide Of Layer: 2-7mm
High Of Layer: 5-10
Packaging: Bags or Cartons
Productivity: 500 Pieces Per week
Place of Origin: Made in China
Supply Ability: 500 Pieces Per week
HS Code: 8208101900
Port: Shanghai Airport,Shanghai Sea Port
Back Grinding Wheels for Silicon Wafer
Back Grinding Wheels have Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.
1. new bond will be developed according to processing materials ;
2. customer can customize blades of different specifications and work performance
3. New hot pressing molding technology ensures product quality stability
QFN.Optical Glass.ceramic materials ect.
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