Find Resin-Bond Grinding Wheels, Diamond Resin Glass Polishing Wheels, Resin Bond Cutting Wheels on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Home > Products > Sail Grinding Wheel Series > Sail Resin-bond Grinding Wheels > Back Grinding Wheels for Silicon Wafer

Back Grinding Wheels for Silicon Wafer

Basic Info

Model No.: SD2000N125

Product Description

Back Grinding Wheels for Silicon Wafer

Back Grinding Wheels have Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.

Product characteristics

1. new bond will be developed according to processing materials ;

2. customer can customize blades of different specifications and work performance

3. New hot pressing molding technology ensures product quality stability

6

Processing objects

QFN.Optical Glass.ceramic materials ect.


Contact us if you need more details on Resin-Bond Grinding Wheels for Silicon Wafer. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Best Quality Latest Back Grinding Diamond Wheels for Silicon Waf、Grinding Wheels for Silicon Wafer. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Grinding Wheel Series > Sail Resin-bond Grinding Wheels

Email to this supplier
  • *Subject:
  • To:

  • *Messages:
    Your message must be between 20-8000 characters