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Grinding wheels for Silicon Wafers

Basic Info

Model No.: SD2000N

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Cutting Wheel

Cylindricity: <0.02

Circular Degree: <0.01

Technics: Sinter

Working Style: Tool Grinding

Product Name: Resin-bond Grinding Wheels

Diamond: SD

Particle Size: 2000

HARDNESS: N

Concentration: 125%

Bond: RB05

Outerside Diameter: 250D

INSIDE DIAMETER: 30

Thickness: 25

Product Description


Resin Grinding Wheel is a kind of high strength wheel, which has a certain degree of flexibility and good self-sharpening. Resin grinding wheel is mainly grinding with diamond, belong to superhard grinding wheel, it grinding efficiency is much higher than silicon carbide grinding wheel. Grinding wheel is widely used in rough grinding, fine grinding and free grinding.

At present, our company resin grinding wheel is widely used in fine grinding of hard brittle materials surface, such as sapphire. It can effectively dissipate the hot in abrasive layer, can improve the grinding performance, and it also can improve surface roughness.

Grinding Wheels

Characters

Superfine diamond was used to improve work piece the precision and surface roughness;

It can achieve excellent service life and continuous stable processing quality.

Processing object

Silicon wafers Sapphire

Specifications

SD 2000- N 125- B01

diamond particle size hardness concentration bond

250D- 30H- 40W- 25T

Outside diameter Inside diameter Width Thickness


Contact us if you need more details on Resin-Bond Grinding Wheels for Silicon Wafers. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Grinding Wheels for Sapphaire、Silicon Wafers of Grinding Wheel. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Grinding Wheel Series > Sail Resin-bond Grinding Wheels

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