Company Details

  • Suzhou Sail Science & Technology Co., Ltd.

  •  [Jiangsu,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Worldwide
  • Exporter:51% - 60%
  • Certs:ISO9001
  • Description:Resin-bond Grinding Wheels for Silicon Wafers,Grinding Wheels for Sapphaire,Silicon Wafers of Grinding Wheel
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Suzhou Sail Science & Technology Co., Ltd.

Resin-bond Grinding Wheels for Silicon Wafers,Grinding Wheels for Sapphaire,Silicon Wafers of Grinding Wheel

Home > Products > Sail Grinding Wheel Series > Sail Resin-bond Grinding Wheels > Grinding wheels for Silicon Wafers

Grinding wheels for Silicon Wafers

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    Payment Type: L/C,T/T
    Incoterm: FOB,CIF,CIP
    Min. Order: 100 Bag/Bags
    Delivery Time: 15 Days

Basic Info

Model No.: SD2000N

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Cutting Wheel

Cylindricity: <0.02

Circular Degree: <0.01

Technics: Sinter

Working Style: Tool Grinding

Product Name: Resin-bond Grinding Wheels

Diamond: SD

Particle Size: 2000

HARDNESS: N

Concentration: 125%

Bond: RB05

Outerside Diameter: 250D

INSIDE DIAMETER: 30

Thickness: 25

Additional Info

Packaging: Bags/Cartons

Productivity: 1200PCS PER MONTH

Brand: SAIL-TECH

Transportation: Ocean,Air

Place of Origin: SUZHOU INDUSTRIAL PARK

Supply Ability: 300PCS PER WEEK

Certificate: ISO9001:2008

HS Code: 8202391000

Port: Shangahi Airport or Shnaghai Port

Product Description


Resin Grinding Wheel is a kind of high strength wheel, which has a certain degree of flexibility and good self-sharpening. Resin grinding wheel is mainly grinding with diamond, belong to superhard grinding wheel, it grinding efficiency is much higher than silicon carbide grinding wheel. Grinding wheel is widely used in rough grinding, fine grinding and free grinding.

At present, our company resin grinding wheel is widely used in fine grinding of hard brittle materials surface, such as sapphire. It can effectively dissipate the hot in abrasive layer, can improve the grinding performance, and it also can improve surface roughness.

Grinding Wheels

Characters

Superfine diamond was used to improve work piece the precision and surface roughness;

It can achieve excellent service life and continuous stable processing quality.

Processing object

Silicon wafers Sapphire

Specifications

SD 2000- N 125- B01

diamond particle size hardness concentration bond

250D- 30H- 40W- 25T

Outside diameter Inside diameter Width Thickness


Looking for ideal Resin-Bond Grinding Wheels for Silicon Wafers Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the Grinding Wheels for Sapphaire are quality guaranteed. We are China Origin Factory of Silicon Wafers of Grinding Wheel. If you have any question, please feel free to contact us.

Product Categories : Sail Grinding Wheel Series > Sail Resin-bond Grinding Wheels

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  • Grinding wheels for Silicon Wafers
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