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Resin-bond Diamond Grinding Wheel

Basic Info

Model No.: SD2000

Product Description


Resin-bond Diamond Grinding Wheel

At present, our company Resin Grinding Wheel is widely used in fine grinding of hard brittle materials surface, such as sapphire. It can effectively dissipate the hot in abrasive layer, can improve the grinding performance, and it also can improve surface roughness.

Resin-bond Diamond Grinding Wheel is a kind of high strength wheel, which has a certain degree of flexibility and good self-sharpening. Resin grinding wheel is mainly grinding with diamond, belong to superhard grinding wheel, it grinding efficiency is much higher than silicon carbide grinding wheel. Grinding wheel is widely used in rough grinding, fine grinding and free grinding.



Characters

Superfine diamond was used to improve work piece the precision and surface roughness;

It can achieve excellent service life and continuous stable processing quality.

Grinding Wheels

Processing object

Silicon wafers Sapphire

Specifications

SD 1200- N 100- B01

diamond particle size hardness concentration bond

250D- 30H- 40W- 25T

Outside diameter Inside diameter Width Thickness


Contact us if you need more details on Silicon Grinding Wheel. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Resin-bond Grinding Wheel for Silicon Wafer、Resin-bond Grinding Wheel for Sapphaire. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Grinding Wheel Series > Sail Resin-bond Grinding Wheels

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