Model No.: SD2000
Shapes: Edge Shape
Types: Cutting Wheel
Circular Degree: <0.01
Working Style: Tool Grinding
Product Name: Resin-bond Grinding Wheels
Particle Size: 2000#
Outerside Diameter: 250D
INSIDE DIAMETER: 30
Resin-bond Diamond Grinding Wheel
At present, our company Resin Grinding Wheel is widely used in fine grinding of hard brittle materials surface, such as sapphire. It can effectively dissipate the hot in abrasive layer, can improve the grinding performance, and it also can improve surface roughness.
Resin-bond Diamond Grinding Wheel is a kind of high strength wheel, which has a certain degree of flexibility and good self-sharpening. Resin grinding wheel is mainly grinding with diamond, belong to superhard grinding wheel, it grinding efficiency is much higher than silicon carbide grinding wheel. Grinding wheel is widely used in rough grinding, fine grinding and free grinding.
Superfine diamond was used to improve work piece the precision and surface roughness;
It can achieve excellent service life and continuous stable processing quality.
Silicon wafers Sapphire
SD 1200- N 100- B01
diamond particle size hardness concentration bond
250D- 30H- 40W- 25T
Outside diameter Inside diameter Width Thickness