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Hub Blades for Ceramic Substrate Materials

Basic Info

Model No.: SA2

Type: Angle Grinder

Power Source: Electricity

Object: Saw Blade

Application: Construction

Disc(Wheel) Type: Grinding Disc

Material: Metal

Working Style: Grain

Disc Diameter: 100mm

Variable Speed: With Variable Speed

Grit Size(um): 1~3um,2-4um

HARDNESS: Soft, Normal,Hard

Concentration: AC,BC,CC,DC,EC

Exposure: 390mm-1020mm

Kerf: 16-40mm Or Special

Product Description

Hub blades100mm-electroplated-diamond-grinding-cup-wheel-for are widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.

The comapny uses the advanced electroplating process and unique diamond dispersion technology,can make The Hub Blade

of different specifications,hardness and concentration,the different craft and formula are used for different customers.

We can effectively improve the quality and life of the dicing blade under the premise of meet the requirements of customers cutting .The blades are main used for PCB,BGA,ceramic substrate materials and Silicon wafer of cutting ang scribing.

Contact us if you need more details on Hub Blades for Ceramic Substrate Materials. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Ceramic Substrate Hub Blades、Super Metal Bond Dicing Blades. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Blade Series > Sail Nickel Diamond Hob Blade

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