Find Sail Metal-Bond Grinding Wheels, Grinding Wheels, Metal-Bond Wheels on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Basic Info

Type: Die Grinder

Power Source: Electricity

Object: Turning Tool

Application: Construction

Disc(Wheel) Type: Grinding Disc

Material: Metal

Working Style: High-speed universal

Disc Diameter: 230mm

Variable Speed: With Variable Speed

Product Name: Metal-bond Grinding Wheels

Abrasive: Synthetic Diamond

Grit: 270-8000

Bond: M/V/R

Outer Diameter: 200~304

Thickness: 5

Product Description

Sintered Grinding Wheels(Metal-Bond Wheels)

The Metal-bond wheels are mainly used for back thinning of sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer.This Kind of grinding wheel developed in our company can replace imported products.

Material of workpieces:

Sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer

Sintered Metal Grinding Wheels

specification




Contact us if you need more details on Sintered Metal Grinding Wheels. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Metal-bond Sintered Grinding Wheel、Sintered Diamond Grinding Wheel. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Grinding Wheel Series > Sail Metal-bond Grinding Wheels

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