Find Sail Metal-Bond Grinding Wheels, Grinding Wheels, Metal-Bond Wheels on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Basic Info

Model No.: SD400M03

Type: Die Grinder, M

Power Source: Electricity

Object: Turning Tool

Application: Construction, Rough Grinding

Disc(Wheel) Type: Grinding Disc

Material: Metal

Working Style: High-speed universal

Disc Diameter: 230mm

Variable Speed: With Variable Speed

Bond: Metal

Material Of Workpieces: Sappire

Fetures: Long Life And High Efficiency

Outer Diameter: 200-304mm

Wide Of Layer: 2-7mm

High Of Layer: 5-10

Grit: 270-8000

Product Description

The Grinding Wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.
Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM

Grinding Wheel

6A2T grinding wheels


1.Be used with Japanese, German, American, Korea and Chinese grinders
2.Superior grinding performance
3.High cost performance



Contact us if you need more details on Back Grinding Wheel for LED. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Back Grinding Wheel for Sapphire Wafer、Sapphire Wafere Grinding Wheel. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Grinding Wheel Series > Sail Metal-bond Grinding Wheels

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