Grinding Wheels(Metal-Bond Wheels)
The Metal-bond wheels are mainly used for back thinning of sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer.This Kind of grinding wheel developed in our company can replace imported products.
Material of workpieces:
Sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer
Contact us if you need more details on Sapphire with Electroplated Grinding Wheel. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Sapphire Electroplated Grinding、Grinding Wheels for Sapphire. If these products fail to match your need, please contact us and we would like to provide relevant information.
Product Categories : Sail Grinding Wheel Series > Sail Metal-bond Grinding Wheels