Diamond and CBN Wheels
Basic Info
Model No.: SD01
Product Description
Sapphire Grinding wheel are mainly used for back thinning of sapphire epitaxial wafer, silicon
wafer, gallium arsenide and GaN wafer. This kind of grinding wheel developed in our company can replace
imported products. They can be used steadily on the Japanese, Korean grinders with high performance.
Workpiece processed:
Sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer
Material of work pieces:
Synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials
Grinders:
SHUWA SGM-6301,NTS Nano Surface-180G,NTS Nanosurface 250/NC-VDM,WEC
This type of wheel is mainly used for fine grinding in photovoltaic semiconductor industry. With high efficiency and cost effective, it performs well on Japan and Germany grinding machines,which mainly used for back thinning of sapphire epitaxial wafer, silicon wafer,gallium aresenide and GaN wafer.
Feathers:
1.Good self-sharpening performance and good elasticity
2.High grinding efficiency and low grinding temperature
3.High processing precision and good surface quality
Application:
1. Grinding Wheels for sapphire wafer
2. excllent quality.
3, steady working
4. long life time.
5. high performance
Specfication:
| hape code | Profile Sketch | Conventional Specification (mm) | ||
| Out diameter D | Thickness T | Hole diameter H | ||
| 6A2 | 175 | 30, 35 | 76 | |
| 200 | 35 | 76 | ||
| 375 | 40 | 127 | ||
| 6A2T | 195 | 22.5, 25 | 170 | |
| 280 | 30 | 228.6 | ||
| 350 | 35 | 235 | ||
| 6A2T | 209 | 22.5 | 158 | |
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Product Categories : Sail Grinding Wheel Series > Sail Metal-bond Grinding Wheels
