Find Sail Metal-Bond Grinding Wheels, Grinding Wheels, Metal-Bond Wheels on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Basic Info

Model No.: SD400

Type: Die Grinder

Power Source: Electricity

Object: Turning Tool

Application: Construction

Disc(Wheel) Type: Grinding Disc

Material: Metal

Working Style: High-speed universal

Disc Diameter: 230mm

Variable Speed: With Variable Speed

Product Name: Metal-bond Grinding Wheels

Abrasive: Synthetic Diamond

Grit: 270-8000

Bond: M/V/R

Outer Diameter: 200~304

Thickness: 5

Product Description

 Grinding Wheel

Grinding Wheels(Metal-Bond Wheels)

The Metal-bond wheels are mainly used for back thinning of sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer.This Kind of grinding wheel developed in our company can replace imported products.

Material of workpieces:

Sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer

specification




Contact us if you need more details on Ultra-thin Metal-bond Wheels for LED Wafer. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Metal Sintered Grinding Wheel、Glass Edge Polishing Abrasive Wheels. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Grinding Wheel Series > Sail Metal-bond Grinding Wheels

Email to this supplier
  • *Subject:
  • To:

  • *Messages:
    Your message must be between 20-8000 characters