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Grinding Wheels for GaN Wheels

Basic Info

Model No.: SM03

Product Description

 Grinding Wheel

Grinding Wheels(Metal-Bond Wheels)

The Metal-bond wheels are mainly used for back thinning of sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer.This Kind of grinding wheel developed in our company can replace imported products.

Material of workpieces:

Sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer

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Product Categories : Sail Grinding Wheel Series > Sail Metal-bond Grinding Wheels