Company Details

  • Suzhou Sail Science & Technology Co., Ltd.

  •  [Jiangsu,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Worldwide
  • Exporter:51% - 60%
  • Certs:ISO9001
  • Description:Diamond Hub Dicing Blade,Diamond Hubless Dicing Blade,Electroformed Diamond Hub Dicing Blade
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Suzhou Sail Science & Technology Co., Ltd.

Diamond Hub Dicing Blade,Diamond Hubless Dicing Blade,Electroformed Diamond Hub Dicing Blade

Diamond hub dicing blade

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    Payment Type: L/C,T/T
    Incoterm: FOB,CIF,CIP
    Min. Order: 100 Bag/Bags
    Delivery Time: 15 Days

Basic Info

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Cutting Wheel

Grain Size: 280#

Cylindricity: <1

Circular Degree: <1

Technics: Electroplating

Working Style: Cutting

Product Name: Resin-bond Grinding Wheels

Diamond: SD

Particle Size: 2000#


Concentration: 100%

Bond: RB05

Outerside Diameter: 750D


Thickness: 0.09

Additional Info

Packaging: Bags/Cartons

Productivity: 1200PCS PER MONTH


Transportation: Ocean,Air


Supply Ability: 300PCS PER WEEK

Certificate: ISO9001:2008

HS Code: 8202391000

Port: Shangahi Airport or Shnaghai Port,Shanghai Seaport

Product Description

The type: diamond hub dicing blade and diamond hubless dicing blade
electroformed diamond hub dicing blade
easy to handle ultra-thin blade; blade dicing after laser grooving; variety of different grit concentrations; shows stable processing performance in high load processing
2.hub dicing blade
application: silicon wafers, compound semiconductor wafers (gaas, gap),oxide wafers (litao3)
3.resin dicing blade
high processing quality for cutting of hard, brittle materiais; able to precisely control diamond concentration to achieve cutting quality; improved cut quality on hard materials
hubless dicing
glass, crystal, quart, litao3, ceramics, optical, qfn, splitter
metal dicing blade

metal dicing balde
high rigidityminimized wavy and slant cutti
g ; able to control diamond concentration to
achieve cutting quality ;excellent rigidit and
cut quality
application: electronic parts, optical devices, semiconductor packages, bga, csp,
electroformed dicing balde
electroformed dicing
wide selection of blade options; proprietary
thin-blade technology ;blade thickness - 0.0
15 mm to 0.3 mm; available for both dicing
saws and slicers
application: various types of semiconductor packages, ceramics, magnetic materials, pcb, silicon.

  • Brand Name : More super
  • Place of Origin : china
  • Blade Material : diamondHubless Baldes

Looking for ideal Diamond Hub Dicing Blade Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the Diamond Hubless Dicing Blade are quality guaranteed. We are China Origin Factory of Electroformed Diamond Hub Dicing Blade. If you have any question, please feel free to contact us.

Product Categories : Sail Blade Series > Sail Electroformed Hubless Diamond Blade

Product Images
  • Diamond hub dicing blade
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