Model No.: SAL2
Hubless blade are widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.
Hubless Blades enables step function improvement on package singulation quality, precision and productivity by providing significantly longer life blade, improved stability. It is designed to fit and achieve your process and project requirement.
1. Cutting-edge electro-plating technology for achieving high quality singulation blades.
2. Significant UPH improvement by enabling high feeding speed.
3. 100% pre-dressed to shorten on-site dressing steps to enable full cutting power.
4. Attractive Cost of Ownership through consistent long blade life.
The blade Specifications:
|The blade bond||Abrasive||Thehnics||The blade thickness|
|The blade precisiong||Cutting material||Abrasive size||O.D.|
|64|| || |
The cutting parameters:
|Spindle rate||Feed speed||cut depth|