Resin Polishing Wheel
Product Description
Resin Polishing Wheel
Resin Polishing Wheel are porous,which mainly used for back thinning of wafer.This Kind of Grinding Wheels also have a long life and high-speeding .
Feature:
l Porous
l High-speed(Vmax=500μm/min)
l Long life and good quality
l Offer variety of special requirements.
Material of workpieces:
Discrete device ,silicon wafer
Product Categories : The Blade Series > Resin Grinding Wheel
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