A new bond material was developed for the Resin Bond Blade BF series to match the characteristics of the material that will be processed. The BF series realizes long service life and high-grade processing for various types of semiconductor packages semiconductor package, such as QFN, PCB, etc.
These blades employ heat-hardened resin as the bonding agent which provides active self-sharpening and elasticity characteristics. There is a wide range of bonds for different materials, some bonds pay attention to low wear, some bonds focus on high-grade processing but accompanied with low wear resistance reduced. With the newly develop bond range, it is possible to satisfy cutting requirements of different materials. Most of the blades use diamond as grinding particle, CBN is rarely used. The diamond concentration and grain size can be precisely controlled to support various cutting needs. In addition, the blade size can be customized, including blade thickness and blade diameter, according to clients` requirements.
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