Diamond Wafer Hub Dicing Blade

Diamond Dicing Blades

By employing new technologies and imported facilities, Sail company produce series electroplated bond blade with Hub is our company`s high level product. A combination of an ultra-thin Diamond Blade and a aluminum hub provides enhanced operation efficiency and stable cutting result. By adjusting blade strengthens rigidity and prevents slant or wavy cutting, avoid blade`s broken.

Features:

High strength, high accuracy, ultra-thin, long life and easy to operation

Bevel and step cutting

Shorter blade change time-increased productivity.

Wide range of grit sizes and bond types to support various application requirements

Applications: Silicon, Gallium arsenide, Gallium phosphide, Gallium arsenide phosphide, etc.