Metal Bond Grinding Hard Usage Diamond Abrasive Wheels
Basic Info
Model No.: D305
Product Description
Grinding Wheels(Metal-Bond Wheels)
The Metal-bond wheels are mainly used for back thinning of sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer. This Kind of grinding wheel developed in our company can replace imported products.
Material of workpieces:
Sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer
Product Categories : Sail Grinding Wheel Series > Sail Metal-bond Grinding Wheels
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