Hubless Blades for BGA Materials

Hubless blade are widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.

Hubless Blades enables step function improvement on package singulation quality, precision and productivity by providing significantly longer life blade, improved stability. It is designed to fit and achieve your process and project requirement.

Features:

1. Cutting-edge electro-plating technology for achieving high quality singulation blades.

2. Significant UPH improvement by enabling high feeding speed.

3. 100% pre-dressed to shorten on-site dressing steps to enable full cutting power.

4. Attractive Cost of Ownership through consistent long blade life.

The blade Specifications:

The blade bond	Abrasive	Thehnics	The blade thickness
Nickel	Diamond	Eletroplating	70~200μm
The blade precisiong	Cutting material	Abrasive size	O.D.
10μm	LED	400~2000#	55.56~60.00mm

Slotting specification:

Number	Width(mm)	Depth(mm)
8	0.5	1
16	1	2
32	1.2	3
64

The cutting parameters:

Spindle rate	Feed speed	cut depth
30~50K/min	10~60mm/s	0.3~1.2mm

Contact us if you need more details on Hubless Blades for BGA Materials. We are ready to answer your questions on packaging, logistics, certification or any other aspects about BGA Materials Hubless Blade、Hubless Blade. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Blade Series > Sail Electroformed Hubless Diamond Blade