1A8 Resin Bond Diamond Cutting Blade For Semiconductor

Resin Bond Blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting requirements.What's more,we can provide customers service for different specifications and types according their needs.

Features:

1. High accurace

2. Long life span

3. Strong hold of grits

4. Slight cutting depth

5. Good wear resistance

6. Good shape keeping ability

Cutting conditons

Spindle speed	25-30K RPM
Feed Speed	120mm/sec
Depth into UV tape	50um

Specifications

Shape

Shape

1A8

Specification

Grit type	Grite size	Concentration	Bond
SDC	180		BF813

Grit Type

SD	Standard grit
SDC	Coating grit

Mesh Size

Mesh size	SD	SDC
180	ok
220	ok
240	ok
320	ok
400	ok	ok
500	ok	ok
600	ok	ok
8000	ok	ok

Contact us if you need more details on 1A8 Resin Bond Diamond Cutting Blade For Semiconductor. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Super Resin Bond Dicing Blade、Dicing Blade. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > Resin Bond Blade