The Hubless Nickel Dicing Blade for Packaging Materials

The Hubless Blade is a breakthrough from traditional package singulation solution,enabling step function improvement on cut quality, precision & productivity with significantly longer blade life, enabling ZERO Conversion of your singulation process.

Features:

1. Up to 6X longer blade life

2.Hubless configuration available (ZERO machine conversion)

3.Tailor made for specific application needs

4.17um, 30um, 40um, 50um, 60um, 70um diamond grit available for BGA, QFN and Ceramic application

5.55.6mm, 58mm OD available

6.Optional slits for better heat dissipation

The blade Specifications:

The blade bond	Abrasive	Thehnics	The blade thickness
Nickel	Diamond	Eletroplating	100~400μm
The blade precisiong	Cutting material	Abrasive size	O.D.
10μm	PCB QFN BGA	400~1000#	56.00~58.00mm

Slotting specification:

Number	Width(mm)	Depth(mm)
8	0.5	1
16	1	2
32	1.2	3
64

The cutting parameters:

Spindle rate	Feed speed	cut depth
30~50K/min	10~60mm/s	0.5~2.0mm

Contact us if you need more details on The Packaging Materials Cutting. We are ready to answer your questions on packaging, logistics, certification or any other aspects about The Low Wear Blade、The Shape Keeping Blade. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > The Hubless Nickel Dicing Blade