High Precision blade Cutting Sapphire Crystal

The metal sintered ultra thin and precision Diamond Blade is with the speciality of strong-hold grains and exellent wearability. It fits to be used for the cutting and grooving of electronic and optical materials, also could be used for the cutting and grooving of ceramic and Semiconductor Materials with its good rigidity.

Features:

1. Grinding efficiently, good wear resistance,
2.small grinding force, low grinding temperature
3.good quality of processing.
4.best diamond material
5.Used for sharpening, grinding, abrasive

Cutting conditons

Spindle speed	17-20K RPM
Feed Speed	5mm/sec
sapphire crystal	0.3mm

Specifications

Shape

Shape

1A8

Specification

Grit type	Grite size	Concentration	Bond
SD	1000	25	MS09T2H

Grit Type

SD	Standard grit
SDC	Coating grit

Mesh Size

Mesh size	SD	SDC
4000	ok
2500	ok
2000	ok
1500	ok
1200	ok	ok
1000	ok	ok
900	ok	ok
800	ok	ok
700	ok	ok
600	ok	ok
500	ok	ok
400	ok	ok
320	ok	ok

Dimension

O.D.	Blade thickness	I.D.
53	0.1	40

D.D.(mm)		Blade thickness(mm)		I.D
Availability size	Tolerance	Availabiility size	Tolerance	Availabiility size	Tolerance
50-100	+0.05/-0	0.05-0.5	±0.005	25.4-88.9	H6

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Product Categories : The Blade Series > Metal-Bond Dicing Blade