The hub nickel Dicing blade for Silicon

The Hub Nickel Dicing Blade of ALHN series design for Silicon cutting. the blade use the special surface treatment technology in plating substrates, the substrates can reach mirror surface, mechanical precision < 2μm. The blade have the few deflection and high cutting quality application for Silicon cutting.

The blade parameters:

The blade bond: Nickel abrasive: Diamond

Technics: Electroplating The blade thickness: 20~35μm

The blade precision:±3μm Cutting material: Silicon

Spindle rate: 30K/min Feed speed:60~80mm/s

Cut depth:<0.3mm

The blade features:

1.High precision cutting.

2.High quality cutting.

3.High strength blade.

4.A Wide Range of Grit Sizes

5.Choose From many Diamond Concentrations

Contact us if you need more details on The Silicon Wafer Dicing Blades. We are ready to answer your questions on packaging, logistics, certification or any other aspects about The High Accuracy Dicing Tools、Low Back Side Chipping. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > The Hub Nickel Dicing Blade