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untra-thin 1A8 Resin Bond Diamond Blades

Product Description


  • Untra-thin 1A8 Resin Bond Diamond Blades
  • We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor.

    The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor.

    Also the products are used for the precision processing of hard and fragile materials, such as quartz, glass, ceramics, etc.
  • Resin Bond Blade 2

  • Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
  • Resin Blade thickness varies from 0.1mm to 1.0 mm (depending on diamond grit size)
  • Diamond grit size ranges from 170# to1200 # (depending on blade thickness)



Contact us if you need more details on 1A8 Resin Bond Diamond Blades. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Ultra-precision Diamond Dicing Saws、Resin Bonded Griding Wheel. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > Nickel-Bond Dicing Blades

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