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Home > Products > The Blade Series > Nickel-Bond Dicing Blades > Series QFN RESIN-BOND DICING BLADES


Basic Info

Model No.: B1A8SDC170N

Product Description

  • Series QFN Resin-Bond Dicing Blades

  • Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
  • Resin Blade thickness varies from 0.1mm to 1.0 mm (depending on diamond grit size)
  • Diamond grit size ranges from 170# to1200 # (depending on blade thickness)

Contact us if you need more details on RESIN-BOND DICING BLADES. We are ready to answer your questions on packaging, logistics, certification or any other aspects about RESIN-BOND DICING BLADES FOR DFN、RESIN-BOND DICING BLADES FOR QFN. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > Nickel-Bond Dicing Blades

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