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Series QFN RESIN-BOND DICING BLADES

Basic Info

Model No.: B1A8SDC170N

Type: Die Grinder

Power Source: Electricity

Object: Saw Blade

Application: Construction

Disc(Wheel) Type: Cutting Disc

Material: Metal

Working Style: High-speed universal

Disc Diameter: 100mm

Variable Speed: With Variable Speed

No: None

Product Description


  • Series QFN Resin-Bond Dicing Blades

  • Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
  • Resin Blade thickness varies from 0.1mm to 1.0 mm (depending on diamond grit size)
  • Diamond grit size ranges from 170# to1200 # (depending on blade thickness)
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Product Categories : The Blade Series > Nickel-Bond Dicing Blades

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