Series QFN RESIN-BOND DICING BLADES
Basic Info
Model No.: B1A8SDC170N
Product Description
- Series QFN Resin-Bond Dicing Blades
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- Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
- Resin Blade thickness varies from 0.1mm to 1.0 mm (depending on diamond grit size)
- Diamond grit size ranges from 170# to1200 # (depending on blade thickness)
Product Categories : The Blade Series > Nickel-Bond Dicing Blades
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