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Home > Products > Sail Blade Series > Sail Ultre-thin Metal-bond Blade > Metal Superthin Cutting Blades

Metal Superthin Cutting Blades

Basic Info

Model No.: IA8

Product Description

Dicing blade 58mm 100mm 150mm 152mm 175mm 200mm 250mm Diamond Grinding Wheels for cutting wafer/ Magnetic materials /carbide / Optical Glass / Gemstone

Product Overviews

1.The introduction of Super Thin Diamond /CBN Grinding wheel / Dicing blade/ Grinding disc / Diamond CBN cutting wheel


Mainly used for grooving and cutting various crisp and hard materials.

Such as semiconductor and packaging material,

tungsten carbide bar,

glass tube,

ceramic tube, magnetic material,




printing circuit board etc.

Metal Bond Diamond Superthin Cutting Wheel For Cutting Wafer

Main Type

It includes 1A1 and 1A1R type,1A1 mainly used for high precision cutting and grooving;

1A1R mainly used for parts large depth cutting and grooving.

The shape can be produced with steel plate or without steel plate.

Contact us if you need more details on Dicing Blade For Magnetic Materials. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Metal Bond Diamond Superthin Cutting Wheel for Cutting Wafer、Dicing Blade For Magnetic Materials. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Blade Series > Sail Ultre-thin Metal-bond Blade

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