Model No.: MIE8SD1500
Shapes: Edge Shape
Types: Surface Grinding Wheel
Grain Size: 100#, 170#-1200#
Circular Degree: <0.1
Working Style: Surface Grinding
Place Of Origin: Suzhou, China (Mainland)
Brand Name: Sail
Type: Metal Saw Blade
Blade Material: Diamond
Usage: Cutting And Slotting
Name: 1A8 Metal Bond Dicing Blade For Semiconductor Comp
Cutting Material: QFN,PQFN,optical Glass,quartz,ceramic,carbide
High precision diamond & CBN saw blade are used for cutting carbide,optics, sapphire, ceramics
and semiconductor material
Metal bond blade
Good wear resistance, good shape maintenance and long worklife.
Goodself-sharpen, perfect fracture surface quality.
Saw blade without steel plate
With thin thickness and high precision, they are mainly used for grooving and cutting with high
accuracy and slight cutting depth.