Find Ultra-thin Metal-bond Dicing Blade, Sail Ultre-thin Metal-bond Blade, Metal Sintered Ultra-Thin Dicing Blade on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Home > Products > Sail Blade Series > Sail Ultre-thin Metal-bond Blade > Metal-bond Dicing Blade for BGA

Basic Info

Model No.: M1A8

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Surface Grinding Wheel

Grain Size: 100#, 170#-1200#

Cylindricity: <0.1

Circular Degree: <0.1

Technics: Electroplating

Working Style: Surface Grinding

Place Of Origin: Suzhou, China (Mainland)

Brand Name: Sail

Type: Resin Saw Blade

Blade Material: Diamond

Finishing: DIAMOND

Size: 52-150mm

Usage: Cutting And Slotting

Name: 1A8 Resin Bond Dicing Blade For Semiconductor Comp

Cutting Material: QFN,PCB,optical Glass,quartz,ceramic,carbide

Product Description

thin Diamond Saw Blade
1. High cutting efficiency with better smoothness
2. Competitive price

Processing objects

QFN.Optical Glass.ceramic materials ect.

Features:

1.Long life and stable performance

2.Good cutting result and high efficiency

3.Produce all kinds of specifications

4.Any package upon request

5.Delivery on time

6.Accept small quantity orders


Metal-Bond Dicing Blade for BGA1e8 Metal Bond Cutting Blades

Contact us if you need more details on Metal-bond Dicing Blade for BGA. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Metal-bond Dicing Blade for Sapphire、Metal-bond Dicing Blad E for Quartzs. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Blade Series > Sail Ultre-thin Metal-bond Blade

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