Find Ultra-thin Metal-bond Dicing Blade, Sail Ultre-thin Metal-bond Blade, Metal Sintered Ultra-Thin Dicing Blade on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Home > Products > Sail Blade Series > Sail Ultre-thin Metal-bond Blade > 1E8 Metal Bond Cutting Blades

1E8 Metal Bond Cutting Blades

Basic Info

Model No.: M1E8

Product Description


Grinding Wheels(Metal-Bond Wheels)

The Metal-bond wheels are mainly used for back thinning of sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer.This Kind of grinding wheel developed in our company can replace imported products.

blades series

Material of workpieces:

Sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer



Contact us if you need more details on 1E8 Metal Bond Cutting Blades. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Ultra-Thin Metal-Bond Dicing Blade、Metal Bond Cutting Blades. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Blade Series > Sail Ultre-thin Metal-bond Blade

Email to this supplier
  • *Subject:
  • To:

  • *Messages:
    Your message must be between 20-8000 characters