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Silicon wafer grinding wheels

Basic Info

Model No.: SD07

Product Description

Sapphire Grinding wheel are mainly used for back thinning of sapphire epitaxial wafer, silicon

wafer, gallium arsenide and GaN wafer. This kind of grinding wheel developed in our company can replace

imported products. They can be used steadily on the Japanese, Korean grinders with high performance.

Workpiece processed:

Sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer

Material of work pieces:

Synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials

Grinders:

SHUWA SGM-6301,NTS Nano Surface-180G,NTS Nanosurface 250/NC-VDM,WEC


This type of wheel is mainly used for fine grinding in photovoltaic semiconductor industry. With high efficiency and cost effective, it performs well on Japan and Germany grinding machines,which mainly used for back thinning of sapphire epitaxial wafer, silicon wafer,gallium aresenide and GaN wafer.


Feathers:

1.Good self-sharpening performance and good elasticity

2.High grinding efficiency and low grinding temperature

3.High processing precision and good surface quality

Application:
1. Grinding Wheels for sapphire wafer
2. excllent quality.
3, steady working
4. long life time.
5. high performance


Specfication:

hape code

Profile Sketch

Conventional Specification (mm)

Out diameter D

Thickness

T

Hole diameter H

6A2

175

30, 35

76

200

35

76

375

40

127

6A2T

195

22.5, 25

170

280

30

228.6

350

35

235

6A2T

209

22.5

158


Contact us if you need more details on Silicon Wafer Grinding Wheels. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Grinding Wheels、Metal Grinding Wheels for Silicon Wafer. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Blade Series > Sail Ultre-thin Metal-bond Blade

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