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Sapphaire thinning grinding wheels

Basic Info

Model No.: SD06

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Grain Size: 14#

Cylindricity: <0.02

Circular Degree: <0.01

Technics: Sinter

Working Style: Surface Grinding

Product Description

This type of wheel is mainly used for fine grinding in photovoltaic semiconductor industry. With high efficiency and cost effective, it performs well on Japan and Germany grinding machines,which mainly used for back thinning of sapphire epitaxial wafer, silicon wafer,gallium aresenide and GaN wafer.

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Feathers:

1.Good self-sharpening performance and good elasticity

2.High grinding efficiency and low grinding temperature

3.High processing precision and good surface quality

Application:
1. Grinding Wheels for sapphire wafer
2. excllent quality.
3, steady working
4. long life time.
5. high performance


Specfication:

hape code

Profile Sketch

Conventional Specification (mm)

Out diameter D

Thickness

T

Hole diameter H

6A2

175

30, 35

76

200

35

76

375

40

127

6A2T

195

22.5, 25

170

280

30

228.6

350

35

235

6A2T

209

22.5

158


Contact us if you need more details on Sapphaire Thinning Grinding Wheels. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Sapphaire Grinding Wheels、Sapphaire Epitaxial Wafer. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Blade Series > Sail Ultre-thin Metal-bond Blade

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