Basic Info
Model No.: M1A8
Product Description
The metal sintered ultra thin and precision Diamond Blade is with the speciality of strong-hold grains and exellent wearability. The Metal-Bond Dicing Blade fits to be used for the cutting and grooving of electronic and optical materials, also could be used for the cutting and grooving of ceramic and Semiconductor Materials with its good rigidity.
It is available for the application that is wide from brittle materials such as glass or the Ceramics to semiconductor packages such as CSP or QFN by an abundant bond lineup,especially for WLCSP cutting. In addition, the sharpness and balance of the life provide the product which they got by intensive degree control a high particle size.
Features:
Metal bond Diamond Saw Blade has the following features:
1.These products ahow very attractive operational properties including high cutting alility.
2.high wear resistance, long life, high geometrical precision of working and fixing parts.
3.good fracture resistance and high grinding quality.
Cutting conditons:
| Spindle speed | 25-30K RPM |
| Feed Speed | 8mm/sec |
| Depth into UV tape | 40um |
Specifications:
Shape
| Shape |
| 1A8 |
| Grit type | Grite size | Concentration | Bond |
| SD | 800 | 25 | MR0209D |
Grit Type
SD Standard grit SDC Coating grit
Mesh Size
Mesh size SD SDC 4000 ok
2500 ok
2000 ok
1500 ok
1200 ok
ok
1000 ok
ok
900 ok
ok
800 ok
ok
700 ok
ok
600 ok
ok
500 ok
ok
400 ok
ok
320 ok
ok
Dimension
| O.D. | Blade thickness | I.D. |
| 52 | 0.07 | 40 |
Product Categories : Sail Blade Series > Sail Ultre-thin Metal-bond Blade
