Model No.: M1A8
The metal sintered ultra thin and precision Diamond Blade is with the speciality of strong-hold grains and exellent wearability. The Metal-Bond Dicing Blade fits to be used for the cutting and grooving of electronic and optical materials, also could be used for the cutting and grooving of ceramic and Semiconductor Materials with its good rigidity.It is available for the application that is wide from brittle materials such as glass or the Ceramics to semiconductor packages such as CSP or QFN by an abundant bond lineup,especially for WLCSP cutting. In addition, the sharpness and balance of the life provide the product which they got by intensive degree control a high particle size.
Metal bond Diamond Saw Blade has the following features:
1.These products ahow very attractive operational properties including high cutting alility.
2.high wear resistance, long life, high geometrical precision of working and fixing parts.
3.good fracture resistance and high grinding quality.
|Spindle speed||25-30K RPM|
|Depth into UV tape||40um|
|Grit type||Grite size||Concentration||Bond|
SD Standard grit SDC Coating grit
Mesh size SD SDC 4000 ok
| O.D. || Blade thickness || I.D. |