Diamond Dicing Blade For Electronic Industry

The metal sintered ultra-thin dicing blade is with the speciality of strong-hold grains and excellend wear-resistance.It fits to be used for the cutting and grooving of electronic and optical materials.

Product characteristics

- Excellent wearing resistance,suitable for the machining of difficult-to-cut materials.

- With high rigidity,Effectively escape from wavy and slant cutting

- Wide range of bonds for different appliactions such as the cutting of glass,ceramics and CSP,etc.

Processing Materials

Ceramics.Sapphire.Optical Glass.quartzs.BGA.CSP

Cutting conditons:

Spindle speed	25-30K RPM
Feed Speed	8mm/sec
Depth into UV tape	40um

Specifications:

Shape

Shape

1E8

Specification

Grit type	Grite size	Concentration	Bond
SD	1000	75	MR09T

Grit Type

SD	Standard grit
SDC	Coating grit

Mesh Size

Mesh size	SD	SDC
4000	ok
2500	ok
2000	ok
1500	ok
1200	ok	ok
1000	ok	ok
900	ok	ok
800	ok	ok
700	ok	ok
600	ok	ok
500	ok	ok
400	ok	ok
320	ok	ok

Dimension

O.D.	Blade thickness	I.D.
52	0.07	40

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Product Categories : Sail Blade Series > Sail Ultre-thin Metal-bond Blade