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Diamond Dicing Blade For Electronic Industry

Basic Info

Model No.: SM1E8

Product Description

The metal sintered ultra-thin dicing blade is with the speciality of strong-hold grains and excellend wear-resistance.It fits to be used for the cutting and grooving of electronic and optical materials.

Product characteristics

- Excellent wearing resistance,suitable for the machining of difficult-to-cut materials.

- With high rigidity,Effectively escape from wavy and slant cutting

- Wide range of bonds for different appliactions such as the cutting of glass,ceramics and CSP,etc.

Processing Materials

Ceramics.Sapphire.Optical Glass.quartzs.BGA.CSP




Cutting conditons:

Spindle speed 25-30K RPM
Feed Speed 8mm/sec
Depth into UV tape 40um

Specifications:

Shape

Shape
1E8
Specification

Grit type Grite size Concentration Bond
SD 1000 75 MR09T

Grit Type

SD Standard grit
SDC Coating grit

Mesh Size

Mesh size SD SDC
4000 ok
2500 ok

2000 ok

1500 ok

1200 ok
ok
1000 ok
ok
900 ok
ok
800 ok
ok
700 ok
ok
600 ok
ok
500 ok
ok
400 ok
ok
320 ok
ok

Dimension

O.D.
Blade thickness
I.D.
52 0.07 40


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Product Categories : Sail Blade Series > Sail Ultre-thin Metal-bond Blade

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