Company Details

  • Suzhou Sail Science & Technology Co., Ltd.

  •  [Jiangsu,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Worldwide
  • Exporter:51% - 60%
  • Certs:ISO9001
  • Description:Diamond Dicing Blade For Electronic Industry,Ultra-thin Metal-bond Dicing Blade,Dicing Blade for Sapphire
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Suzhou Sail Science & Technology Co., Ltd.

Diamond Dicing Blade For Electronic Industry,Ultra-thin Metal-bond Dicing Blade,Dicing Blade for Sapphire

Home > Products > Sail Blade Series > Sail Ultre-thin Metal-bond Blade > Diamond Dicing Blade For Electronic Industry

Diamond Dicing Blade For Electronic Industry

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    Payment Type: T/T
    Incoterm: FOB,CIF,CIP
    Min. Order: 30 Bag/Bags
    Delivery Time: 10 Days

Basic Info

Model No.: SM1E8

Type: Die Grinder

Power Source: Electricity

Object: Saw Blade

Application: Construction

Disc(Wheel) Type: Cutting Disc

Material: Metal

Working Style: High-speed universal

Disc Diameter: 100mm

Variable Speed: With Variable Speed

No: None

Additional Info

Packaging: Bags or Cartons

Productivity: 1200PCS PER MONTH

Brand: SAIL-TECH

Transportation: Air

Place of Origin: SUZHOU INDUSTRIAL PARK

Supply Ability: 300PCS PER WEEK

Certificate: ISO9001:2015

HS Code: 8202391000

Port: Shanghai Airport

Product Description

The metal sintered ultra-thin dicing blade is with the speciality of strong-hold grains and excellend wear-resistance.It fits to be used for the cutting and grooving of electronic and optical materials.

Product characteristics

- Excellent wearing resistance,suitable for the machining of difficult-to-cut materials.

- With high rigidity,Effectively escape from wavy and slant cutting

- Wide range of bonds for different appliactions such as the cutting of glass,ceramics and CSP,etc.

Processing Materials

Ceramics.Sapphire.Optical Glass.quartzs.BGA.CSP




Cutting conditons:

Spindle speed 25-30K RPM
Feed Speed 8mm/sec
Depth into UV tape 40um

Specifications:

Shape

Shape
1E8
Specification

Grit type Grite size Concentration Bond
SD 1000 75 MR09T

Grit Type

SD Standard grit
SDC Coating grit

Mesh Size

Mesh size SD SDC
4000 ok
2500 ok

2000 ok

1500 ok

1200 ok
ok
1000 ok
ok
900 ok
ok
800 ok
ok
700 ok
ok
600 ok
ok
500 ok
ok
400 ok
ok
320 ok
ok

Dimension

O.D.
Blade thickness
I.D.
52 0.07 40


Looking for ideal Diamond Dicing Blade For Electronic Industry Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the Ultra-Thin Metal-Bond Dicing Blade are quality guaranteed. We are China Origin Factory of Dicing Blade for Sapphire. If you have any question, please feel free to contact us.

Product Categories : Sail Blade Series > Sail Ultre-thin Metal-bond Blade

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  • Diamond Dicing Blade For Electronic Industry
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