Thinning or Back Grinding Wheel
Product Description
This type of wheel is mainly used for fine grinding in photovoltaic semiconductor industry. With high efficiency and cost effective, it performs well on Japan and Germany grinding machines,which mainly used for back thinning of sapphire epitaxial wafer, silicon wafer,gallium aresenide and GaN wafer.
Feathers:
1.Good self-sharpening performance and good elasticity
2.High grinding efficiency and low grinding temperature
3.High processing precision and good surface quality
Application:
1. Grinding Wheels for sapphire wafer
2. excllent quality.
3, steady working
4. long life time.
5. high performance
Specfication:
hape code | Profile Sketch | Conventional Specification (mm) | ||
Out diameter D | Thickness T | Hole diameter H | ||
6A2 | 175 | 30, 35 | 76 | |
200 | 35 | 76 | ||
375 | 40 | 127 | ||
6A2T | 195 | 22.5, 25 | 170 | |
280 | 30 | 228.6 | ||
350 | 35 | 235 | ||
6A2T | 209 | 22.5 | 158 |
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Product Categories : Sail Blade Series > Sail Ultre-thin Metal-bond Blade